The global   hermetic packaging market   size stood at USD 3.95 billion in 2023. The market revenue is anticipated to rise from USD 4.21 billion in 2024 to USD 7.31 billion by 2032, registering a CAGR of 7.14% from 2024 to 2032.

Hermetic packaging is widely used to protect electronic components from corrosive environments. An increase in research and development initiatives in the aerospace and defense sector is boosting the adoption of hermetic packaging solutions. Rising emphasis on sustainable packaging solutions to reduce environmental issues is propelling market expansion.

Fortune Business Insights presents this information in their report titled " Hermetic Packaging   Market, 2024–2032".

Segments

Increasing Usage of Ceramic Metal Sealing in Implantable Electronic Devices Propels Segment Growth

By type, the market is classified into co-fired ceramic, metal can, epoxy seal, ceramic metal sealing, and glass metal sealing. The ceramic metal sealing segment accounts for the largest hermetic packaging market share owing to the increasing usage of ceramic metal sealing in implantable electronic devices. Growing preference for ceramic packaging over other materials due to its superior hermetic protection is boosting segment growth.

Surging Need for Excellent Heat Dissipation and High Optical Precision in Sensors Boosts Segment Expansion

On the basis of the application, the market is divided into sensors, photodiodes, MEMS, transistors, laser chips, memory, and others. The sensors segment takes the lead in the global market. The surging need for excellent heat dissipation and high optical precision in sensors is augmenting segment growth.

Aerospace & Defense Segment Leads the Market due to Rise in Defense Budgets

In terms of end-use industry, the market is segregated into aerospace & defense, healthcare, automotive, electrical & electronics, telecom, and others. The aerospace & defense segment dominates the global market driven by a rise in security threats, changing political dynamics, and increasing defense budgets. A rise in government and private investments in space exploration is accelerating segment expansion.

From the regional ground, the market is classified into Europe, Latin America, North America, Asia Pacific, and the Middle East & Africa.

Report Coverage

The market research report presents a comprehensive market examination, emphasizing crucial elements, including the competitive environment and prominent product categories. Moreover, the report offers valuable insights on market trends and significant industry developments. Apart from the factors above, the report includes many factors that have boosted market expansion in recent times.

Market Drivers

Several key drivers are contributing to the growth of the hermetic packaging market:

• Increased Demand for Aerospace and Defense Applications : The global rise in defense budgets, as well as the expansion of space exploration activities, is driving demand for hermetically sealed components.
• Growth in Healthcare Devices : With the increasing use of electronics in medical devices such as pacemakers and neurostimulators, the need for reliable packaging solutions has surged.
• Advancement in Automotive Electronics : The integration of advanced driver assistance systems (ADAS), autonomous driving technologies, and electric vehicle (EV) components is bolstering demand for hermetic packaging in the automotive sector.

Nevertheless, the growing preference for other substitutes is hindering the hermetic packaging market growth.

Regional Insights

Increase in the Production of Several Electronic Devices and Components Fueled Market Growth in Asia Pacific

Asia Pacific commands the global market with the increasing production of several electronic devices and components.

North America has the second-largest share of the market. The presence of many aerospace companies and the rapid expansion of the aeronautics industry are the key factors fostering market growth in the region.

Competitive Landscape

Key Players Focus on Increasing Their Customer Base Across Regions

The global market is highly competitive. Some players emphasize offering innovative packaging solutions to make a mark in the global market. These market participants are engaged in innovation and increasing their customer base across regions.

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Key Industry Development

• September 2023 : SCHOTT AG introduced lightweight microelectronic packages for aerospace. These packages are preferred as RF packages, microwave, and DC converter packages, specifically in aircraft and satellite applications.

List of Key Players Profiled in the Market Report:

• TELEDYNE (U.S.)
• SCHOTT (Germany)
• Amkor Technology, Inc. (U.S.)
• KYOCERA Corporation (Japan)
• Materion Corporation (U.S.)
• Egide (France)
• SGA Technologies (U.K.)
• Complete Hermetics (U.S.)
• Willow Technologies Ltd. (U.K.)
• Mackin Technologies (Japan)